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dc.creatorZuazua-Ros, A. (Amaia)-
dc.creatorRamos-González, J. (Juan Carlos)-
dc.creatorMartín-Gómez, C. (César)-
dc.creatorGomez-Acebo, T. (Tomás)-
dc.creatorPisano, A. (A.)-
dc.date.accessioned2018-06-20T12:17:28Z-
dc.date.available2018-06-20T12:17:28Z-
dc.date.issued2018-
dc.identifier.citationZuazua-Ros, A. (Amaia); Ramos-González, J. (Juan Carlos); Martín-Gómez, C. (César); et al. "Comparative analysis of heat dissipation panels for a hybrid cooling system integrated in buildings". IOP Conference series. Earth and environmental science. (154), 2018, 1 - 8es
dc.identifier.issn1755-1307-
dc.identifier.urihttps://hdl.handle.net/10171/53240-
dc.description.abstractThe use of cooling panels as heat dissipation elements integrated in buildings has been previously investigated by the authors. Those elements would be connected to the condenser and would dissipate the heat in a passive form. Following the research, this study analyses and compares the thermal performance of two heat dissipation panels as part of a hybrid cooling system. Both panels were experimentally tested under different variables, thus having nine scenarios for each panel. Additionally, an already validated model was applied. The empirical results show a considerable difference between the cooling capacity among them, doubling the daily average ratio in one scenario. The heat dissipation ratios vary between 106 and 227 W/m2 in the first case and 140 and 413 W/m2 in the second. Regarding the model applicability, the average error for each panel was 4.0% and 8.5%. The bond between the metal sheet and the pipes of the panels has proven to be the main parameter to assure the highest heat dissipation potential of each panel.-
dc.language.isoen-
dc.rightsinfo:eu-repo/semantics/openAccess-
dc.subjectIngeniería Civil y Arquitectura-
dc.titleComparative analysis of heat dissipation panels for a hybrid cooling system integrated in buildings-
dc.typeinfo:eu-repo/semantics/article-
dc.description.noteThis is an open access article distributed under the Creative Commons: Atribution License (cc BY)-
dc.identifier.doi10.1088/1755-1315/154/1/012008-

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